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Numerical strategies for the prediction of patterned wafer warpage during manufacturing process
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024
DOI · BibTeXA Hybrid-Displacement POD-based finite element formulation: Application to a linear elastic perforated plate
Finite Elements in Analysis and Design, 2026
DOI · BibTeXCost-effectiveness of super-element and mean-field homogenization approaches for linear elastic multiscale problems requiring localization
Computers & Structures, 2026
DOI · BibTeXtalks
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teaching
Teaching experience 1
Undergraduate course, University 1, Department, 2014
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Workshop, University 1, Department, 2015