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Numerical strategies for the prediction of patterned wafer warpage during manufacturing process

Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024

Keywords: wafer warpage, patterned wafer, Finite Element Analysis, Homogenization, wafer scale

Recommended citation: [1] F. Roqueta, M. Boutaleb, P.V.K. Nguyen, J.-M. Mencik, Numerical strategies for the prediction of patterned wafer warpage during manufacturing process, in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024: pp. 1–6.
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A Hybrid-Displacement POD-based finite element formulation: Application to a linear elastic perforated plate

Published in Finite Elements in Analysis and Design, 2026

Keywords: Hybrid-Displacement formulation; Proper Orthogonal Decomposition; Super-element; Stress concentration; Multi-hole structure

Recommended citation: P.V.K. Nguyen, F. Massa, C. Hubert, B. Langrand, N. Leconte, A Hybrid-Displacement POD-based finite element formulation: Application to a linear elastic perforated plate, Finite Elements in Analysis and Design 257 (2026) 104552.
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Cost-effectiveness of super-element and mean-field homogenization approaches for linear elastic multiscale problems requiring localization

Published in Computers & Structures, 2026

Keywords: Multiscale problem; Perforated plate; Transformation field analysis; Mori-Tanaka; Hybrid-Trefftz displacement

Recommended citation: P.V.K. Nguyen, B. Langrand, F. Massa, C. Hubert, N. Leconte, Cost-effectiveness of super-element and mean-field homogenization approaches for linear elastic multiscale problems requiring localization, Computers & Structures 332 (2026) 108459.
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Teaching experience 1

Undergraduate course, University 1, Department, 2014

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Teaching experience 2

Workshop, University 1, Department, 2015

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