P.V.K. Nguyen, B. Langrand, F. Massa, C. Hubert, N. Leconte, Cost-effectiveness of super-element and mean-field homogenization approaches for linear elastic multiscale problems requiring localization, Computers & Structures 332 (2026) 108459.
P.V.K. Nguyen, F. Massa, C. Hubert, B. Langrand, N. Leconte, A Hybrid-Displacement POD-based finite element formulation: Application to a linear elastic perforated plate, Finite Elements in Analysis and Design 257 (2026) 104552.
F. Roqueta, M. Boutaleb, P.V.K. Nguyen, J.-M. Mencik, Numerical strategies for the prediction of patterned wafer warpage during manufacturing process, in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024: pp. 1–6.
Conference proceedings talk at Testing Institute of America 2014 Annual Conference, Los Angeles, CA, USA
Talk at London School of Testing, London, UK
Tutorial at UC-Berkeley Institute for Testing Science, Berkeley, CA, USA
Talk at UC San Francisco, Department of Testing, San Francisco, CA, USA